PCB UV Picosecond Laser Cutting Machine For Film Cutting

Introduction

The principle of picosecond laser cutting machine is to focus the laser emitted from the laser into a high power density laser beam, when the laser beam irradiates to the surface of the workpiece, so that the workpiece reaches the melting point or boiling point, while the high-pressure gas coaxial with the beam will melt or vaporize the metal blow away, with the beam and the workpiece relative position of the move, finally make the material to form a slit, so as to achieve the purpose of cutting. Picosecond laser cutting machine has ultra-short pulse time, single pulse action time is only a few picoseconds time, laser action time is short, peak power is high, so its thermal effect is very small, or even negligible.

Ultraviolet picosecond laser cutting machine is the use of ultraviolet short-wavelength laser beam irradiation circuit board surface, so that high energy ultraviolet photons directly destroy the molecular bonds on the surface of the material, to achieve the purpose of processing materials. Ultraviolet laser processing is a cold processing, this cold light etching processing parts of the heat affected zone is small, with smooth edges and a minimum of carbonization. Laser cutting provides users with simple, fast, consumables free, non-contact, non-mechanical, high-precision arbitrary shape marking, semi-cutting, cutting and other solutions to meet the stringent manufacturing requirements, suitable for mass production and rapid changes in processing technology. Widely used in flexible circuit board /PCB hard board, mobile phone protective film, hard film, explosion-proof film, 9H film, touch screen PET, OCA, conductive film and optical film, polarizing film, anti-peeping film, hard film and other non-metallic materials precision cutting and micro-machining.

Application

UV picosecond laser cutting machine can be used in PCB, CVL, FPC, RF, medical catheter and film cutting and punching industries; FPC soft board, covering film, PET film, PI film, PP film, adhesive film, copper foil, explosion-proof film, electromagnetic film, FR4, 3M glue, PI reinforcement, PE film and other films and auxiliary materials cutting. It can also be used to cut various substrates, such as ceramics, silicon wafers, aluminum foil, teflon and so on.

Main features

1, create a new processing mode, can cut any shape products according to CAD drawing files without opening mold, shorten the production cycle, free human resources;

2, high precision, low drift galvanometer and servo system platform combined to bring excellent micron cutting accuracy;

3, stress-free cutting mode and automatic CCD positioning system organic combination brings perfect cutting effect:

4, cutting speed is fast, heat affected zone is small. The depth of the heat affected layer is 0.05-0.1mm, and the thermal distortion is small.

5. Good cutting quality. The edge of the cut is smooth, no collapsing edge, no cutting residue. The cutting accuracy of micrometer level can be achieved in the shape of complex wheel and small curvature radius. The slit is narrow. Generally 0.1--1mm;

6, the green cutting process effectively avoids the harm to the operator and the pollution to the environment

Technical parameters

Advantages

1. No carbonization of cutting edge, no black edge, smooth and flat, large processing format, high efficiency.

2. Non-contact processing, no stress on the material; Small focusing spot, suitable for micro-fine cutting and drilling;

3. Automatic positioning, automatic shrinkage compensation, according to different material thickness set cutting parameters.

Picture for reference