Wafer UV Laser Cutting Machine
Introduction
This equipment belongs to one of the small-format precision laser cutting machine models, mainly used in the fourth stage of IC chip manufacturing process - assembly and packaging (narrow sense of packaging, non-packaging engineering) on the first stage of the process
After this cutting process, the Wafer with certain circuit characteristics is divided into particles with certain size requirements, which are then screened by different electrical standards. Qualified products are delivered to the end customer after packaging (die) and testing process. According to different uses, it becomes a "CPU" for different industry applications (that is, a small rectangular block with different pins and pins).
The device is through a specific laser beam that can have a certain reaction with the material (mainly manifested as absorption effect) through the light guide shaping system of the external optical path, radiate to the wafer under the guidance of the visual mark point, and with the motion mechanism with a certain precision to form a cutting track, to complete the segmentation of small pieces of grain
This page only introduces the simple cutting (square or round small grain forming parts) process of chips less than 6 inches (standard thickness 625±25mmm)
Technical parameters
Name | Laser cutting machine | Adaptive technology | <6" wafer cutting |
Laser class/laser wavelength | DPSS UV laser /355nm | Laser output power | 15W(20/25/30w color and picosecond optional) |
Equipment structure characteristics | Full containment shield + 3D moving platform + integrated structure/dual adaptive tooling (such as tooling adaptive 4' and 6' round) | Loading and unloading method | Manual loading and unloading + tooling/software and visual cooperation can automatically contour finding/double laser head double platform and robot loading and unloading are optional |
XY axis travel/positioning accuracy | 300*400mm/±lμm | Repeated positioning accuracy | 士0.02mm |
Monitoring resolution/positioning accuracy | 2592x1944(5MP)/±3um | Cutting speed | <250mm/s |
Cutting accuracy | <30μm(up to 15μm) | Cutting positioning accuracy | <50μm |
Working environment | AC 220V50Hz(good grounding), 6000W power consumption, temperature 10-30℃; Relative humidity ≤75%RH, water-cooled | ||
Size and weight | 1400*650*1450mm/ about 600kg (includes water cooler) | ||
Picture for reference
